8 Zones Lead Free Reflow Oven

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    2018-06-11 00:53

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Company Profile
Shenzhen HB Automation Equipment Co.,Ltd








HB Industrial Park,No.1 of TianYang Road 6th,Songgang,Bao'an District Shenzhen,China


http://www.smthba.com/ http://hanbao.dqrtyn.com/

Product details

8 zones Lead Free Reflow Oven

HB Automation  Advantages

HB Automation is a comprehensive supplier in the SMT market to provide our customer with a wide range of the most innovative and reliable types of SMT equipment including Reflow oven with 6,8,10,12 zones model, with thermal accuracy of ±1˚C, produces a ΔT of ±2°C across. We have made one of our customers' main production challenges as our own: guaranteeing the highest productivity at the lowest manufacturing cost.






Weight (kg)


Number of heating zones

Top 8+ bottom 8

Length of heating zones(mm)


Number of cooling zones

Top 2 Forced air cooling

Nozzle plate

galvanized plates

Exhaust volume

10M2/min *2 channel exhaust

Control system

Power supply requirements

3 phase, 380V 50/60Hz ( optional: 3 phase, 220V 50/60V)

Total Power


Startup power


Normal Power consumption


Warming time

30 minutes

Temp. setting range

Room temperature to 300°C

Temperature control method

PID Close loop control +SSR Driving

Temperature control precision

+/- 1.0 °C

Temperature deviation on PCB

+/- 1.5°C ( by HB test standard )

Conveyor system

Chain structure

Single buckle for preventing board jammed

Max. PCB width

400mm ( Optional 610mm )

Range of rail width

50mm -400mm (optional 50mm -610mm )

Components clearance

Top/Bottom clearance of PCB: 25mm

Conveyor direction

L to R ( Optional R to L )

PCB transmission method

Chain + Mesh

Conveyor speech

300mm /min-2000mm / min


Auto-lubrication + Manual-lubrication



Main Features

• 8 zones model CS-0802

• Combination pin chain and mesh belt conveyors

• Motorized width adjust (optional: PC control width adjustment)

• Flux collection system


Independent air velocity controlling system allows flexible processing control to easily handle complicated lead free soldering requirements. The CS-0802 has 2 ramp-up zones, 4 soaking zones, 2 reflow zones, and 2 cooling zones.


Q: What is your normal lead time?
A: For standard machine, our lead time is 3 weeks. Customized product may be a little longer.
Q: Why Reflow?
A: Because it is easy, fast, reliable and gives professional results with very little skills to master.

While many SMD components can be soldered with just a standard iron this is generally a very slow process. It also requires some skills to be able to solder smaller components and high-density pins.

Some footprints like QFN are very difficult to be soldered with an iron even for a trained technician and often those joints are not good enough even for prototyping purposes. BGA components are of course impossible to deal with and for them a reflow oven is a must.
Reflow ovens are the first choice in the industry for production and prototyping, the only downside are their cost and the costs related to reflow technique: you are going to need a stencil for every board and you need to use solder paste which is generally quite expansive.

Lately these costs, thanks to some Chinese production facilities and resellers have been lowered from several hundreds of dollars for a steal stencil to less than 20 USD, allowing even hobbyists to build devices with modern and difficult footprints.

The only high cost device to buy is a reflow oven.